DIN EN 60603-12:1998-07
Current
The latest, up-to-date edition.
CONNECTORS FOR FREQUENCIES BELOW 3 MHZ FOR USE WITH PRINTED BOARDS - PART 12: DETAIL SPECIFICATION FOR DIMENSIONS, GENERAL REQUIREMENTS AND TESTS FOR A RANGE OF SOCKETS DESIGNED FOR USE WITH INTEGRATED CIRCUITS
Hardcopy , PDF
German
01-01-1998
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Vorwort
1 Anwendungsbereich
2 Normative Verweisungen
3 IEC-Normbezeichnung
4 Gemeinsame Merkmale
5 Masse
6 Kennwerte
7 Prüfprogramm
8 Dual-in-Line-Fassungen mit Lötanschlüssen für
Leiterplatten (Standard-Ausführung)
9 Dual-in-Line-Fassungen mit lötfreien
Wickelanschlüssen für Leiterplatten
(Standard-Ausführung)
10 Dual-in-Line-Fassungen mit Lötanschlüssen für
Leiterplatten (niedrige Bauhöhe)
11 Dual-in-Line-Fassungen mit lötfreien
Wickelanschlüssen für Leiterplatten
(niedrige Bauhöhe)
12 Einzelziehkraftlehre
13 Fassungslehren
Anhang ZA (normativ) Normative Verweisungen auf
internationale Publikationen mit ihren
entsprechenden europäischen Publikationen
Describes dimensions, general requirements and tests for a range of sockets designed to be used with integrated circuits in dual-in-line format. Covers standard and low-profile types. Does not apply to test/burn-in sockets.
| DevelopmentNote |
Supersedes DIN IEC 60603-12 (05/2002)
|
| DocumentType |
Standard
|
| Pages |
19
|
| PublisherName |
German Institute for Standardisation (Deutsches Institut für Normung)
|
| Status |
Current
|
| Supersedes |
| Standards | Relationship |
| SN EN 60603-12 : 1998 | Identical |
| EN 60603-12:1998 | Identical |
| IEC 60603-12:1992 | Identical |
| BS EN 60603-12:1998 | Identical |
| NBN EN 60603-12 : 1998 | Identical |
| NF EN 60603-12 : 1998 | Identical |
| DIN IEC 60512-6:1994-05 | ELECTROMECHANICAL COMPONENTS FOR ELECTRONIC EQUIPMENT; BASIC TESTING PROCEDURES AND MEASURING METHODS; PART 6: CLIMATIC TESTS AND SOLDERING TESTS |
| DIN EN 60097:1993-09 | Grid systems for printed circuits (IEC 60097:1991); German version EN 60097:1993 |
| DIN IEC 60512-8:1994-05 | ELECTROMECHANICAL COMPONENTS FOR ELECTRONIC EQUIPMENT; BASIC TESTING PROCEDURES AND MEASURING METHODS; PART 8: CONNECTOR TESTS (MECHANICAL) & MECHANICAL TESTS ON CONTACTS & TERMINATIONS |
| DIN IEC 60512-7:1994-05 | ELECTROMECHANICAL COMPONENTS FOR ELECTRONIC EQUIPMENT; BASIC TESTING PROCEDURES AND MEASURING METHODS; PART 7: MECHANICAL OPERATING TESTS AND SEALING TESTS |
| DIN IEC 60512-2 : 1994 AMD 1 1995 | ELECTROMECHANICAL COMPONENTS FOR ELECTRONIC EQUIPMENT; BASIC TESTING PROCEDURES AND MEASURING METHODS; PART 2: GENERAL EXAMINATION, ELECTRICAL CONTINUITY AND CONTACT RESISTANCE TESTS, INSULATION TESTS AND VOLTAGE STRESS TESTS |
| DIN 4763:1981-03 | PROGRESSIVE RATIO OF NUMBER VALUES OF SURFACE ROUGHNESS PARAMETERS |
| DIN IEC 60512-3:1994-05 | ELECTROMECHANICAL COMPONENTS FOR ELECTRONIC EQUIPMENT; BASIC TESTING PROCEDURES AND MEASURING METHODS - PART 3: CURRENT-CARRYING CAPACITY TESTS |
| DIN IEC 60512-5:1994-05 | ELECTROMECHANICAL COMPONENTS FOR ELECTRONIC EQUIPMENT; BASIC TESTING PROCEDURE AND MEASURING METHODS; PART 5: IMPACT TESTS (FREE COMPONENTS), STATIC LOAD TESTS (FIXED COMPONENTS), ENDURANCE TESTS AND OVERLOAD TESTS |
| DIN IEC 60512-9:1994-05 | ELECTROMECHANICAL COMPONENTS FOR ELECTRONIC EQUIPMENT; BASIC TESTING PROCEDURES AND MEASURING METHODS; PART 9: MISCELLANEOUS TESTS |
| DIN EN 60352-1:1998-04 | SOLDERLESS CONNECTIONS - PART 1: WRAPPED CONNECTIONS - GENERAL REQUIREMENTS, TEST METHODS AND PRACTICAL GUIDANCE |
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