CEI EN 61249-4-1 : 2010
Current
The latest, up-to-date edition.
MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 4-1: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD (FOR THE MANUFACTURE OF MULTILAYER BOARDS) - EPOXIDE WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY
Hardcopy , PDF
English
01-01-2010
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FOREWORD
1 Scope
2 Normative references
3 Materials and construction
4 Properties
5 Delivery form
6 Quality assurance
7 Packaging and marking
8 Shelf life
9 Ordering information
Annex ZA (normative) - Normative references
to international publications
with their corresponding
European publications
Bibliography
Defines requirements for properties of prepreg that is mainly intended to be used as bonding sheets in connection with laminates according to IEC 61249-2-7 when manufacturing multilayer boards in line with IEC 62326-4.
| Committee |
CT 309
|
| DevelopmentNote |
Classificazione CEI 91-39. (07/2010)
|
| DocumentType |
Standard
|
| Pages |
20
|
| PublisherName |
Comitato Elettrotecnico Italiano
|
| Status |
Current
|
| Standards | Relationship |
| IEC 61249-4-1:2008 | Identical |
| EN 61249-4-1:2008 | Identical |
| IEC 61249-2-7:2002 | Materials for printed boards and other interconnecting structures - Part 2-7: Reinforced base materials clad and unclad - Epoxide woven E-glass laminated sheet of defined flammability (vertical burning test), copper-clad |
| ISO 11014-1:1994 | Safety data sheet for chemical products Part 1: Content and order of sections |
| EN 61249-2-7:2002/corrigendum:2005 | MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-7: REINFORCED BASE MATERIALS CLAD AND UNCLAD - EPOXIDE WOVEN E-GLASS LAMINATED SHEET OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD |
| IEC 62326-4:1996 | Printed boards - Part 4: Rigid multilayer printed boards with interlayer connections - Sectional specification |
| EN 61189-3:2008 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards) |
| IEC 61189-3:2007 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards) |
| ISO 14001:2015 | Environmental management systems — Requirements with guidance for use |
| IEC 60194:2015 | Printed board design, manufacture and assembly - Terms and definitions |
| EN ISO 14001:2015 | Environmental management systems - Requirements with guidance for use (ISO 14001:2015) |
| ISO 9000:2015 | Quality management systems — Fundamentals and vocabulary |
| EN 62326-4:1997 | Printed boards - Part 4: Rigid multilayer printed boards with interlayer connections - Sectional specification |
| IEC 61189-2:2006 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures |
| EN ISO 9000:2015 | Quality management systems - Fundamentals and vocabulary (ISO 9000:2015) |
| EN 61189-2:2006 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures |
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