CEI EN 60749-20-1 : 2010
Current
The latest, up-to-date edition.
SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 20-1: HANDLING, PACKING, LABELLING AND SHIPPING OF SURFACE-MOUNT DEVICES SENSITIVE TO THE COMBINED EFFECT OF MOISTURE AND SOLDERING HEAT
Hardcopy , PDF
English
01-01-2010
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FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Terms and definitions
4 General applicability and
reliability considerations
5 Dry packing
6 Drying
7 Use
Annex A (normative) - Symbol
and labels for
moisture-sensitive
devices
Annex B (informative) - Board
rework
Annex C (informative) - Derating
due to factory environmental
conditions
Bibliography
Defines to all non-hermetic SMD packages which are subjected to reflow solder processes and which are exposed to the ambient air.
| Committee |
CT 309
|
| DevelopmentNote |
Classificazione CEI 47-66. (09/2010)
|
| DocumentType |
Standard
|
| Pages |
38
|
| PublisherName |
Comitato Elettrotecnico Italiano
|
| Status |
Current
|
| Standards | Relationship |
| IEC 60749-20-1:2009 | Identical |
| EN 60749-20-1 : 2009 | Identical |
| IEC 60749-20:2008 | Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat |
| IEC 60749-30:2005+AMD1:2011 CSV | Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing |
| EN 60749-30 : 2005 AMD 1 2011 | SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 30: PRECONDITIONING OF NON-HERMETIC SURFACE MOUNT DEVICES PRIOR TO RELIABILITY TESTING |
| EN 60749-20:2009 | Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat |
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