CECC 75101-807 : 1994
Withdrawn
A Withdrawn Standard is one, which is removed from sale, and its unique number can no longer be used. The Standard can be withdrawn and not replaced, or it can be withdrawn and replaced by a Standard with a different number.
MODULAR TWO-PART CONNECTORS FOR PRINTED BOARDS AND BACKPLANES, GRIDOF 2.5 mm - ACCORDING TO IEC 917 (DETAIL SPECIFICATION)
02-06-2016
12-01-2013
Foreword
Preface
1 General data
1.l Recommended method of mounting
1.2 Minimum and maximum number of contacts
1.3 Ratings and characteristics
1.4 Related documents
1.5 Marking
1.6 Ordering Information
2 Characteristics
2.1 Climatic category
2.2 Electrical
2.3 Mechanical
3 Dimensional information
3.1 Drawings and dimensions
4 Test schedule
4.1 General
4.2 Test schedule tables
5 Quality assessment procedures
5.1 Qualification approval testing
5.2 Quality conformance inspection
5.3 Delayed delivery, re-inspection
ANNEX A (normative): Test phase BP3.2: Corrosion,
industrial atmosphere
Gives detail specification for modular two-part connectors for printed boards and backplanes, grid of 2.5 mm, according to IEC 60917.
| Committee |
SR 48B
|
| DocumentType |
Standard
|
| PublisherName |
Cenelec Electronic Components Committee
|
| Status |
Withdrawn
|
| Standards | Relationship |
| I.S. CECC 75101-807:1994 | Identical |
| EN 175100 : 1992 | HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS - SECTIONAL SPECIFICATION: TWO PART AND EDGE SOCKET CONNECTORS FOR PRINTED BOARD APPLICATIONS |
| IEC 60512-8:1993 | Electromechanical components for electronic equipment; basic testing procedures and measuring methods - Part 8: Connector tests (mechanical) and mechanical tests on contacts and terminations |
| IEC 60068-1:2013 | Environmental testing - Part 1: General and guidance |
| IEC 60512-6:1984 | Electromechanical components for electronic equipment; basic testing procedures and measuring methods. Part 6: Climatic tests and soldering tests |
| IEC 60512-7:1993 | Electromechanical components for electronic equipment; basic testing procedures and measuring methods - Part 7: Mechanical operating tests and sealing tests |
| IEC 60352-1:1997 | Solderless connections - Part 1: Wrapped connections - General requirements, test methods and practical guidance |
| IEC 60410:1973 | Sampling plans and procedures for inspection by attributes |
| ISO 468:1982 | Surface roughness — Parameters, their values and general rules for specifying requirements |
| IEC 60352-5:2012 | Solderless connections - Part 5: Press-in connections - General requirements, test methods and practical guidance |
| IEC 60512-4:1976 | Electromechanical components for electronic equipment; basic testing procedures and measuring methods. Part 4: Dynamic stress tests |
| IEC 60512-9:1992 | Electromechanical components for electronic equipment; basic testing procedures and measuring methods - Part 9: Miscellaneous tests |
| IEC 60512-5:1992 | Electromechanical components for electronic equipment; basic testing procedures and measuring methods - Part 5: Impact tests (free components), static load tests (fixed components), endurance tests and overload tests |
| IEC 60512-1:2001 | Connectors for electronic equipment - Tests and measurements - Part 1: General |
| IEC 60326-3:1991 | Printed boards - Part 3: Design and use of printed boards |
| IEC 60512-3:1976 | Electromechanical components for electronic equipment; basic testing procedures and measuring methods. Part 3: Current-carrying capacity tests |
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