BS IEC 60300-3.7 : 1999
Current
The latest, up-to-date edition.
DEPENDABILITY MANAGEMENT - APPLICATION GUIDE - RELIABILITY STRESS SCREENING OF ELECTRONIC HARDWARE
Hardcopy , PDF
English
01-01-1999
FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Definitions
4 Acronyms
5 General considerations for a reliability stress
screening programme
6 General information about the reliability stress
screening process
7 Analysis of the benefits of the reliability stress
screening process
8 Characteristics of a successful reliability stress
screening programme
9 Screening types
10 Screening levels
11 Screening strength
12 Selection of screens
13 Flaws detected by a reliability stress screening
process
14 Pre-production screening process
15 Planning, performing and eliminating a reliability
stress screening process
15.1 General
15.2 Step 1 - Identification of objectives and goals
15.3 Step 2 - Screening process design and application
15.4 Step 3 - Cost-benefit analysis
15.5 Step 4 - Preparation of a screening plan
15.6 Step 5 - Screening process data collection,
analysis and corrective actions
Figures
1 Levels where reliability stress screening can be
performed
2 Reliability stress screening of repairable items
3 Flow chart for control of a reliability stress
screening process
A.1 Level chosen for the RSS process
Table
A.1 Relation between the sensitivity of flaws and stresses
Annex A (informative) RSS of repairable items produced
in lots
Annex B (informative) RSS of electronic components
Acts as an application guide to a reliability stress screening process for electronic hardware. Explains the concept, purpose and justification of the screening process, and states the main elements of a screening programme, as well as the general planning method.
Committee |
DS/1/1
|
DevelopmentNote |
Supersedes 96/402942 DC. (06/2005)
|
DocumentType |
Standard
|
Pages |
38
|
PublisherName |
British Standards Institution
|
Status |
Current
|
Supersedes |
Standards | Relationship |
IEC 60300-3-7:1999 | Identical |
03/101534 DC : DRAFT JAN 2003 | BS 5760-4 - RELIABILITY OF SYSTEMS, EQUIPMENT AND COMPONENTS - PART 4: GUIDE TO THE SPECIFICATION OF DEPENDABILITY REQUIREMENTS |
BS 5760-4:2003 | Reliability of systems, equipment and components Guide to the specification of dependability requirements |
MIL-STD-883 Revision K:2016 | TEST METHOD STANDARD - MICROCIRCUITS |
MIL-STD-750 Revision F:2011 | TEST METHODS FOR SEMICONDUCTOR DEVICES |
IEC 61163-1:2006 | Reliability stress screening - Part 1: Repairable assemblies manufactured in lots |
IEC 61163-2:1998 | Reliability stress screening - Part 2: Electronic components |
IEC 60749:1996+AMD1:2000+AMD2:2001 CSV | Semiconductor devices - Mechanical and climatic test methods |
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