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BS EN 62572-3:2016

Current

Current

The latest, up-to-date edition.

Fibre optic active components and devices. Reliability standards Laser modules used for telecommunication

Available format(s)

Hardcopy , PDF

Language(s)

English

Published date

30-06-2016

$443.41
Including GST where applicable

FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Terms, definitions, symbols
  and abbreviations
4 Laser reliability and quality assurance
  procedure
5 Tests
6 Activities
Annex A (informative) - Guidance on testing
        in Table 1 and Table 2
Bibliography
Annex ZA (normative) - Normative references to
         international publications with their
         corresponding European publications

Specifies reliability assessment of laser modules used for telecommunication.

Committee
GEL/86/3
DevelopmentNote
Supersedes 09/30183239 DC. (03/2012) Supersedes 13/30277892 DC. (08/2014) Supersedes 15/30323391 DC. (06/2016)
DocumentType
Standard
Pages
26
PublisherName
British Standards Institution
Status
Current
Supersedes

This part of IEC 62572 deals with reliability assessment of laser modules used for telecommunication.

The aim of this standard is

  • to establish a standard method of assessing the reliability of laser modules in order to minimize risks and to promote product development and reliability;

  • to establish means by which the distribution of failures with time can be determined. This should enable the determination of equipment failure rates for specified end of life criteria.

In addition, guidance is given in IEC TR 62572-2.

Standards Relationship
IEC 62572-3:2016 Identical
EN 62572-3:2016 Identical

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IEC 60749-25:2003 Semiconductor devices - Mechanical and climatic test methods - Part 25: Temperature cycling
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IEC 60749-11:2002 Semiconductor devices - Mechanical and climatic test methods - Part 11: Rapid change of temperature - Two-fluid-bath method
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IEC 60747-1:2006+AMD1:2010 CSV Semiconductor devices - Part 1: General
EN 60749-8:2003 Semiconductor devices - Mechanical and climatic test methods - Part 8: Sealing
IEC 60749-6:2017 Semiconductor devices - Mechanical and climatic test methods - Part 6: Storage at high temperature
EN 60749-6:2017 Semiconductor devices - Mechanical and climatic test methods - Part 6: Storage at high temperature
EN 60749-26:2014 Semiconductor devices - Mechanical and climatic test methods - Part 26: Electrostatic discharge (ESD) sensitivity testing - Human body model (HBM)
IEC 60068-2-1:2007 Environmental testing - Part 2-1: Tests - Test A: Cold
IEC 60749-10:2002 Semiconductor devices - Mechanical and climatic test methods - Part 10: Mechanical shock
IEC TR 62572-2:2008 Fibre optic active components and devices - Reliability standards - Part 2: Laser module degradation
EN 60749-25:2003 Semiconductor devices - Mechanical and climatic test methods - Part 25: Temperature cycling
IEC 60068-2-14:2009 Environmental testing - Part 2-14: Tests - Test N: Change of temperature
EN 60068-2-14:2009 Environmental testing - Part 2-14: Tests - Test N: Change of temperature
IEC 60749-12:2002 Semiconductor devices - Mechanical and climatic test methods - Part 12: Vibration, variable frequency
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