BS EN 61751:1998
Current
The latest, up-to-date edition.
Laser modules used for telecommunication. Reliability assessment
Hardcopy , PDF
English
15-09-1998
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INTRODUCTION
1 Scope
2 Normative references
3 Terms and definitions
4 Laser reliability and quality assurance procedure
4.1 Demonstration of product quality
4.2 Testing responsibilities
4.3 Quality Improvement Programmes (QIPs)
5 Tests
5.1 Structural similarity
5.2 Burn-in and screening (when applicable in the
DS)
6 Activities
6.1 Analysis of reliability results
6.2 Technical visits to LMMs
6.3 Design/process changes
6.4 Deliveries
6.5 Supplier documentation
Annex A (normative) Laser diode and laser module failure
mechanisms
Annex B (informative) Guide
Annex ZA Normative references to international publications
with their corresponding European publications
Figures
A.1 Non-linearities in laser-current characteristics
A.2 "Bathtub" failure rate curve
A.3 Example of cumulative failure plot showing log-normal
distribution of laser failure rate
A.4 Calculated failure rates for components having a
log-normal distribution of laser failure rate
A.5 Cross-section through a typical laser module showing
key components
A.6 Cross-section through a typical buried heterostructure
laser (bonded junction side up)
Covers reliability assessment of laser modules for telecommunication. Intended to create a standard procedure for assessment of the reliability of laser modules so as to minimize risks and for promotion of product development and reliability.
| Committee |
GEL/86
|
| DevelopmentNote |
Supersedes 93/203878 DC. Also numbered as IEC 61751. (09/2005)
|
| DocumentType |
Standard
|
| Pages |
36
|
| PublisherName |
British Standards Institution
|
| Status |
Current
|
| Supersedes |
| Standards | Relationship |
| SN EN 61751 : 1998 | Identical |
| NF EN 61751 : 1998 | Identical |
| EN 61751:1998 | Identical |
| NBN EN 61751 : 1998 | Identical |
| I.S. EN 61751:1999 | Identical |
| DIN EN 61751:1998-11 | Identical |
| MIL-STD-883 Revision K:2016 | TEST METHOD STANDARD - MICROCIRCUITS |
| EN 60068-2-1:2007 | Environmental testing - Part 2-1: Tests - Test A: Cold |
| HD 323.2.14 : 200S2 | BASIC ENVIRONMENTAL TESTING PROCEDURES - TESTS - TEST N: OF TEMPERATURE |
| IEC 60747-12-2:1995 | Semiconductor devices - Part 12: Optoelectronic devices - Section 2: Blank detail specification for laser diode modules with pigtail for fibre optic systems and sub-systems |
| IEC 60747-1:2006+AMD1:2010 CSV | Semiconductor devices - Part 1: General |
| IEC 60749:1996+AMD1:2000+AMD2:2001 CSV | Semiconductor devices - Mechanical and climatic test methods |
| ISO 9000:2015 | Quality management systems — Fundamentals and vocabulary |
| IEC 60068-2-1:2007 | Environmental testing - Part 2-1: Tests - Test A: Cold |
| IEC 60068-2-14:2009 | Environmental testing - Part 2-14: Tests - Test N: Change of temperature |
| EN ISO 9000:2015 | Quality management systems - Fundamentals and vocabulary (ISO 9000:2015) |
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