BS EN 61076-4-116 : 2012
Current
The latest, up-to-date edition.
CONNECTORS FOR ELECTRONIC EQUIPMENT - PRODUCT REQUIREMENTS - PART 4-116: PRINTED BOARD CONNECTORS - DETAIL SPECIFICATION FOR A HIGH-SPEED TWO-PART CONNECTOR WITH INTEGRATED SHIELDING FUNCTION
Hardcopy , PDF
English
01-01-2012
INTRODUCTION
1 Scope
2 Normative references
3 Terms and definitions
4 General data
5 Technical data
6 Dimensional information
7 Characteristics
8 Test schedule
Bibliography
Annex A (informative) - Vibration and shock testing
of connectors mounted to a mechanical structure
for electronic equipment according to IEC 60917 and
IEC 60297 Test setup of assemblies with mass
loading of printed boards
Annex ZA (normative) - Normative references to
international publications with their
corresponding European publications
Defines specifications and test requirements for a high-speed two-part connector with integrated shielding function for use as a printed board connector in industrial environments.
| Committee |
EPL/48
|
| DevelopmentNote |
Supersedes 10/30210450 DC. (07/2012) 2012 Edition Re-Issued in April 2016 & incorporates AMD 1 2016. Supersedes 13/30278799 DC.(05/2016)
|
| DocumentType |
Standard
|
| Pages |
56
|
| PublisherName |
British Standards Institution
|
| Status |
Current
|
| Supersedes |
| Standards | Relationship |
| IEC 61076-4-116:2012+AMD1:2015 CSV | Identical |
| EN 61076-4-116:2012/A1:2016 | Identical |
| IEC 60068-1:2013 | Environmental testing - Part 1: General and guidance |
| EN 60068-1:2014 | Environmental testing - Part 1: General and guidance |
| EN 60352-5:2012/AC:2014 | SOLDERLESS CONNECTIONS - PART 5: PRESS-IN CONNECTIONS - GENERAL REQUIREMENTS, TEST METHODS AND PRACTICAL GUIDANCE (IEC 60352-5:2012) |
| IEC 60068-2-54:2006 | Environmental testing - Part 2-54: Tests - Test Ta: Solderability testing of electronic components by the wetting balance method |
| IEC 60352-8:2011 | Solderless connections - Part 8: Compression mount connections - General requirements, test methods and practical guidance |
| IEC 60352-5:2012 | Solderless connections - Part 5: Press-in connections - General requirements, test methods and practical guidance |
| EN 60352-8:2011 | Solderless connections - Part 8: Compression mount connections - General requirements, test methods and practical guidance |
| EN 60068-2-54:2006 | Environmental testing - Part 2-54: Tests - Test Ta: Solderability testing of electronic components by the wetting balance method |
| IEEE 802.3AP : 2007 | INFORMATION TECHNOLOGY - TELECOMMUNICATIONS AND INFORMATION EXCHANGE BETWEEN SYSTEMS - LOCAL AND METROPOLITAN AREA NETWORKS - SPECIFIC REQUIREMENTS - PART 3: CARRIER SENSE MULTIPLE ACCESS WITH COLLISION DETECTION (CSMA/CD) ACCESS METHOD AND PHYSICAL LAYER SPECIFICATIONS - AMENDMENT 4: ETHERNET OPERATION OVER ELECTRICAL BACKPLANES |
| IEC 60664-1:2007 | Insulation coordination for equipment within low-voltage systems - Part 1: Principles, requirements and tests |
| IEC 60050-581:2008 | International Electrotechnical Vocabulary (IEV) - Part 581: Electromechanical components for electronic equipment |
| IEC 60068-2-52:2017 | Environmental testing - Part 2-52: Tests - Test Kb: Salt mist, cyclic (sodium chloride solution) |
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