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BS EN 60603-12:1998

Current

Current

The latest, up-to-date edition.

Connectors for frequencies below 3 MHz for use with printed boards Detail specification for dimensions, general requirements and tests for a range of sockets designed for use with integrated circuits

Available format(s)

Hardcopy , PDF

Language(s)

English

Published date

15-05-1998

$443.41
Including GST where applicable

1 Scope
2 Normative references
3 IEC type designation
4 Common features
5 Dimensions
6 Characteristics
7 Test schedule
8 Dual-in-line sockets with solder termination for
    through-board insertion (standard type)
9 Dual-in-line sockets with solderless wire wrapping
    terminations for through-board insertion (standard type)
10 Dual-in-line sockets with solder terminations for
    through-board insertion (low-profile type)
11 Dual-in-line sockets with solderless wire wrapping
    terminations for through-board insertion (low-profile type)
12 Individual contact retention force gauge
13 Socket gauges
Annex ZA (normative) Normative references to international
publications with their corresponding European publications

Describes dimensions, general requirements and tests for a range of sockets designed to be used with integrated circuits in dual-in-line format. Covers standard and low-profile types. Does not apply to test/burn-in sockets.

Committee
EPL/48
DevelopmentNote
Also numbered as IEC 60603-12. (11/2005)
DocumentType
Standard
Pages
26
PublisherName
British Standards Institution
Status
Current

Standards Relationship
NBN EN 60603-12 : 1998 Identical
DIN EN 60603-12:1998-07 Identical
NF EN 60603-12 : 1998 Identical
SN EN 60603-12 : 1998 Identical
EN 60603-12:1998 Identical

IEC 60512-6:1984 Electromechanical components for electronic equipment; basic testing procedures and measuring methods. Part 6: Climatic tests and soldering tests
IEC 60468:1974 Method of measurement of resistivity of metallic materials
IEC 60512-7:1993 Electromechanical components for electronic equipment; basic testing procedures and measuring methods - Part 7: Mechanical operating tests and sealing tests
IEC 60097:1991 Grid systems for printed circuits
IEC 60191-2:2012 DB Mechanical standardization of semiconductor devices - Part 2: Dimensions
IEC 60512-4:1976 Electromechanical components for electronic equipment; basic testing procedures and measuring methods. Part 4: Dynamic stress tests
IEC 60512-5:1992 Electromechanical components for electronic equipment; basic testing procedures and measuring methods - Part 5: Impact tests (free components), static load tests (fixed components), endurance tests and overload tests
IEC 60512-3:1976 Electromechanical components for electronic equipment; basic testing procedures and measuring methods. Part 3: Current-carrying capacity tests

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