BS EN 60127-4 : 2005
Current
The latest, up-to-date edition.
MINIATURE FUSES - PART 4: UNIVERSAL MODULAR FUSE-LINKS (UMF) - THROUGH-HOLE AND SURFACE MOUNT TYPES
Hardcopy , PDF
English
01-01-2005
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INTRODUCTION
1 Scope and object
2 Normative references
3 Terms and definitions
4 General requirements
5 Standard ratings
6 Marking
7 General notes on tests
8 Dimensions and construction
9 Electrical requirements
10 Standard sheets
Annex A (informative) - Mounting for surface mount fuse-links
Bibliography
Annex ZA (normative) - Normative references to international
Publications with their corresponding
European publications
Deals with universal modular fuse-links (UMF) for printed circuits and other substrate systems, used for the protection of electric appliances, electronic equipment, and component parts thereof, normally intended to be used indoors.
| Committee |
PEL/32
|
| DevelopmentNote |
Supersedes 94/202200 DC, 90/34345 DC and 99/201800 DC. (02/2003) Supersedes 02/210447 DC. (06/2005) Supersedes 00/202832 DC. (11/2005) Supersedes 05/30137140 DC. (04/2009) 2005 Edition Re-Issued in July 2013 & incorporates AMD 2 2013. 2005 + A1 2009 Edition is still active & will be withdrawn on 11-01-2016. (07/2013)
|
| DocumentType |
Standard
|
| Pages |
36
|
| PublisherName |
British Standards Institution
|
| Status |
Current
|
| Supersedes |
| Standards | Relationship |
| IEC 60127-4:2005+AMD1:2008+AMD2:2012 CSV | Identical |
| DIN EN 60127-4 : 2013 | Identical |
| SN EN 60127-4 : 2005 | Identical |
| EN 60127-4:2005/A2:2013 | Identical |
| NF EN 60127-4 : 2005 AMD 2 2013 | Identical |
| I.S. EN 60127-4:2005 | Identical |
| NBN EN 60127-4 : 2006 AMD 2 2013 | Identical |
| UNE-EN 60127-4:2006 | Identical |
| BS 1075:1989 | Specification for tungsten halogen lamps (non vehicle) |
| HD 323.2.20 : 200S3 | BASIC ENVIRONMENTAL TESTING PROCEDURES - TESTS - TEST T - SOLDERING |
| IEC 60068-2-58:2015+AMD1:2017 CSV | Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) |
| IEC 60068-2-20:2008 | Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads |
| EN 60068-2-20:2008 | Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads |
| IEC 61190-1-2:2014 | Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly |
| IEC 61249-2-7:2002 | Materials for printed boards and other interconnecting structures - Part 2-7: Reinforced base materials clad and unclad - Epoxide woven E-glass laminated sheet of defined flammability (vertical burning test), copper-clad |
| EN 60127-1:2006/A2:2015 | MINIATURE FUSES - PART 1: DEFINITIONS FOR MINIATURE FUSES AND GENERAL REQUIREMENTS FOR MINIATURE FUSE-LINKS |
| IEC 60068-2-21:2006 | Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices |
| ISO 3:1973 | Preferred numbers Series of preferred numbers |
| IEC 60127-1:2006+AMD1:2011+AMD2:2015 CSV | Miniature fuses - Part 1: Definitions for miniature fuses andgeneral requirements for miniature fuse-links |
| EN 61249-2-7:2002/corrigendum:2005 | MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-7: REINFORCED BASE MATERIALS CLAD AND UNCLAD - EPOXIDE WOVEN E-GLASS LAMINATED SHEET OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD |
| EN 60068-2-21:2006 | Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices |
| IEC 60194:2015 | Printed board design, manufacture and assembly - Terms and definitions |
| EN 60664-1:2007 | Insulation coordination for equipment within low-voltage systems - Part 1: Principles, requirements and tests |
| IEC 61191-2:2017 | Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies |
| ISO 9453:2014 | Soft solder alloys Chemical compositions and forms |
| IEC 60115-8:2009 | Fixed resistors for use in electronic equipment - Part 8: Sectional specification - Fixed surface mount resistors |
| IEC 60326-3:1991 | Printed boards - Part 3: Design and use of printed boards |
| IEC 60664-1:2007 | Insulation coordination for equipment within low-voltage systems - Part 1: Principles, requirements and tests |
| IEC 60115-1:2008 | Fixed resistors for use in electronic equipment - Part 1: Generic specification |
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