BS EN 134000:1995

FOREWORD
1 SCOPE
2 GENERAL
    2.1 Order of precedence
    2.2 Related documents
    2.3 Units and symbols
    2.4 Terminology
    2.5 Marking
3 QUALITY ASSESSMENT PROCEDURES
    3.1 General
    3.2 Primary stage of manufacture
    3.3 Subcontracting
    3.4 Structurally similar components
    3.5 Qualification approval procedures
    3.6 Capability approval procedures
    3.7 Rework and repair work
    3.8 Release for delivery
    3.9 Certified test records of released lots
    3.10 CECC Assessed Process Average procedure (APA)
    3.11 Delayed delivery
    3.12 Alternative test methods
    3.13 Manufacture outside the geographical limits of
         CECC supervising inspectorates
4 TESTS AND MEASUREMENT PROCEDURES
    4.1 General
    4.2 Standard atmospheric conditions
    4.3 Drying
    4.4 Visual examination and check of dimensions
    4.5 Electrical tests
    4.6 Operating torque
    4.7 Locking
    4.8 Locking torque proof
    4.9 End stop torque
    4.10 Thrust and pull (axial)
    4.11 Side thrust
    4.12 Robustness of terminations and integral mounting
         devices
    4.13 Solderability
    4.14 Resistance to soldering heat
    4.15 Component solvent resistance
    4.16 Solvent resistance of marking
    4.17 Rapid change of temperature
    4.18 Vibration
    4.19 Bump
    4.20 Shock
    4.21 Climatic sequence
    4.22 Damp heat, steady state
Section/Clause
4.23 Electrical endurance
4.24 Mechanical endurance
ANNEX A INTERPRETATION OF SAMPLING PLANS AND PROCEDURES
         AS DESCRIBED IN IEC 410
ANNEX B QUALITY FACTOR

Establishes inspection procedures, standard terms and methods of test for use in sectional and detail specifications within the CECC System for electronic components.