BS 6221-21:2001

Foreword
1 Scope
2 Normative references
3 Terms and definitions
4 Classification of defects
5 General
6 Health and safety
7 Removal and restoration
   of protective coatings
8 Defective conductors
9 Lifted conductors
10 Lifted and defective lands
   associated with plain holes
11 Eyelet and tubular pin defects
12 Defective plated-through holes
   (double-sided boards)
13 Base laminate material defects
   (single- and double-sided boards)
14 Inclusions
15 Rework on inner layers of multilayer
   printed boards after lamination
16 Rework of printed
   edge contacts
Bibliography
Figure 1 - Defective conductors
Figure 2 - Tinned copper wire connections
Figure 3 - Insulated wire connections
Figure 4 - Straight conductor rework
           using parallel gap
           welding
Figure 5 - Lifted conductors
Figure 6 - Rework of damaged land
           using overlaid land
Figure 7 - Replacement bonded land
Figure 8 - Lifted land and conductor
Figure 9 - Eyelet and tubular pin
           defects
Figure 10- Rework of defective plated-
           through hole by the wire
           link method
Figure 11- Rework of defective plated-
           through holes (vias) by
           the eyelet method
Figure 12- Rework of defective plated-
           through holes (vias) by
           parallel gap welding: method 1
Figure 13- Rework of defective plated-
           through holes (vias) by
           parallel gap welding: method 2
Figure 14- Damaged base laminate materials
Table 1 - Type 1 defects
Table 2 - Type 2 defects
Table 3 - Applicability of methods for the
           rework of defective conductors

This part gives guidance on the rework of printed boards that has to be carried out in the normal course of fabrication and test before release to the user. Some of the techniques described are suitable for use after acceptance by the user, though their application may invalidate any formal unassembled board release documentation.