ASTM E 801 : 2016 : REDLINE
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
View Superseded by
Standard Practice for Controlling Quality of Radiographic Examination of Electronic Devices
04-01-2022
English
01-12-2016
Important note : All end users must be registered with an Account prior to user licenses being assigned.CONTAINED IN VOL. 03.03, 2017 Defines the radiological examination of electronic devices for internal discontinuities, extraneous material, missing components, crimped or broken wires, and defective solder joints in cavities, in the encapsulating materials, or the boards.
| Committee |
E 07
|
| DocumentType |
Redline
|
| Pages |
5
|
| PublisherName |
American Society for Testing and Materials
|
| Status |
Superseded
|
| SupersededBy |
1.1This practice relates to the radiographic examination of electronic devices for internal discontinuities, extraneous material, missing components, crimped or broken wires, and defective solder joints in cavities, in the encapsulating materials, or the boards. Requirements expressed in this practice are intended to control the quality and repeatability of the radiographic images and are not intended for controlling the acceptability or quality of the electronic devices imaged.
Note 1:Refer to the following publications for pertinent information on methodology and safety and protection: Guides E94 and E1000, and “General Safety Standard for Installation Using Non-Medical X Ray and Sealed Gamma Ray Sources, Energies Up to 10 MeV Equipment Design and Use,” Handbook No. 114.2
1.2If a nondestructive testing agency as described in Practice E543 is used to perform the examination, the testing agency should meet the requirements of Practice E543.
1.3This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use.
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| MIL-STD-883 Revision K:2016 | TEST METHOD STANDARD - MICROCIRCUITS |
| ASTM E 543 : 2015 : REDLINE | Standard Specification for Agencies Performing Nondestructive Testing |
| ASTM E 431 : 1996 : R2002 | Standard Guide to Interpretation of Radiographs of Semiconductors and Related Devices |
| ASTM E 1742/E1742M : 2018 : REDLINE | Standard Practice for Radiographic Examination |
| ASTM E 94 : 2004 | Standard Guide for Radiographic Examination |
| ASTM E 1161 : 2009 : R2014 | Standard Practice for Radiologic Examination of Semiconductors and Electronic Components |
| ASTM E 431 : 1996 | Standard Guide to Interpretation of Radiographs of Semiconductors and Related Devices |
| ASTM E 431 : 1996 : R2011 | Standard Guide to Interpretation of Radiographs of Semiconductors and Related Devices |
| ASTM E 431 : 1996 : R2007 | Standard Guide to Interpretation of Radiographs of Semiconductors and Related Devices |
| ASTM E 94/E94M : 2017 : REDLINE | Standard Guide for Radiographic Examination Using Industrial Radiographic Film |
| ASTM E 1161 : 2009 | Standard Practice for Radiologic Examination of Semiconductors and Electronic Components |
| ASTM E 431 : 1996 : R2016 | Standard Guide to Interpretation of Radiographs of Semiconductors and Related Devices |
| ASTM E 1000 : 2016 : REDLINE | Standard Guide for Radioscopy |
| ASTM E 1255 : 2016 : REDLINE | Standard Practice for Radioscopy |
| ASTM E 543 : 2015 : REDLINE | Standard Specification for Agencies Performing Nondestructive Testing |
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