ASTM D 5109 : 2012 : REDLINE
Current
The latest, up-to-date edition.
Standard Test Methods for Copper-Clad Thermosetting Laminates for Printed Wiring Boards
English
01-11-2012
Important note : All end users must be registered with an Account prior to user licenses being assigned.CONTAINED IN VOL. 10.02, 2015 Specifies the procedures for testing copper-clad laminates produced from fiber-reinforced, thermosetting polymeric materials intended for fabrication of printed wiring boards.
| Committee |
D 09
|
| DocumentType |
Redline
|
| Pages |
11
|
| PublisherName |
American Society for Testing and Materials
|
| Status |
Current
|
1.1 These test methods cover the procedures for testing copper-clad laminates produced from fiber-reinforced, thermosetting polymeric materials intended for fabrication of printed wiring boards.
| Procedure | Section |
| Referenced Documents | |
| Conditioning | |
| Dielectric Breakdown Voltage Parallel to Laminations | |
| Dimensional Instability | |
| Dissipation Factor | |
| Flammability Rating Test | |
| Flexural Strength, Flatwise at Elevated Temperature | |
| Flexural Strength, Flatwise at Room Temperature | |
| Oven Blister Test | |
| Peel Strength Test at Elevated Temperature | |
| Peel Strength Test at Room Temperature | |
| Permittivity | |
| Pin Holes in Copper Surface | 20 |
| Purity of Copper | |
| Scratches in Copper Surface | 21 |
| Solder Float Test | |
| Solvent Resistance | |
| Surface Resistivity | |
| Volume Resistivity | |
| Terminology | |
| Thickness & Thickness Variation | |
| Warp or Twist | |
| Water Absorption |
1.3 Metric units are the preferred units for these test methods. Inch-pound units, where shown, are presented for information only.
1.4 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use. For specific hazard statements, see 7.2.1, 8.1, and 11.3.1.
| ASTM D 1867 : 2013 : REDLINE | Standard Specification for Copper-Clad Thermosetting Laminates for Printed Wiring |
| ASTM D 618 : 2013 : REDLINE | Standard Practice for Conditioning Plastics for Testing |
| ASTM D 1711 : 2015 : REDLINE | Standard Terminology Relating to Electrical Insulation |
| ASTM D 1825 : 2003 | Standard Practice for Etching and Cleaning Copper-Clad Electrical Insulating Materials and Thermosetting Laminates for Electrical Testing (Withdrawn 2012) |
| ASTM D 257 : 2014 : REDLINE | Standard Test Methods for DC Resistance or Conductance of Insulating Materials |
| NEMA LI 1 : 1998(R2011) | INDUSTRIAL LAMINATED THERMOSETTING PRODUCTS |
| ASTM D 374 : 1999 | Standard Test Methods for Thickness of Solid Electrical Insulation |
| ASTM D 1867 : 2013 : REDLINE | Standard Specification for Copper-Clad Thermosetting Laminates for Printed Wiring |
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