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ASTM D 1825 : 2003

Withdrawn

Withdrawn

A Withdrawn Standard is one, which is removed from sale, and its unique number can no longer be used. The Standard can be withdrawn and not replaced, or it can be withdrawn and replaced by a Standard with a different number.

Standard Practice for Etching and Cleaning Copper-Clad Electrical Insulating Materials and Thermosetting Laminates for Electrical Testing (Withdrawn 2012)

Available format(s)

Hardcopy , PDF

Withdrawn date

31-01-2012

Language(s)

English

Published date

01-10-2003

$108.03
Including GST where applicable

CONTAINED IN VOL. 10.01, 2009 Describes a procedure for etching and cleaning copper clad thermosetting laminates for electrical testing.

Committee
D 09
DocumentType
Standard Practice
Pages
2
PublisherName
American Society for Testing and Materials
Status
Withdrawn
Supersedes

1.1 This practice describes a procedure for etching and cleaning copper-clad electrical insulating materials and thermosetting laminates for electrical testing.

1.2 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use. For specific warning statements see 6.3 and 6.4.

SAE AMS 3613 : 2016 FILM, COPPER CLAD POLYESTER
ASTM D 2861 : 2014 : REDLINE Standard Test Methods for Flexible Composites of Copper Foil with Dielectric Film or Treated Fabrics
ASTM D 229 : 2019 Standard Test Methods for Rigid Sheet and Plate Materials Used for Electrical Insulation
ASTM D 2861 : 2014 Standard Test Methods for Flexible Composites of Copper Foil with Dielectric Film or Treated Fabrics (Withdrawn 2020)
ASTM D 5109 : 2012 Standard Test Methods for Copper-Clad Thermosetting Laminates for Printed Wiring Boards (Withdrawn 2020)
ASTM D 5109 : 2012 : REDLINE Standard Test Methods for Copper-Clad Thermosetting Laminates for Printed Wiring Boards

ASTM D 1867 : 2013 : REDLINE Standard Specification for Copper-Clad Thermosetting Laminates for Printed Wiring

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