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Status of Standard is Unknown
BS EN 62668-2 - PROCESS MANAGEMENT FOR AVIONICS - COUNTERFEIT PREVENTION - PART 2: MANAGING ELECTRONIC COMPONENTS FROM NON-FRANCHISED SOURCES
Available format(s)
Hardcopy , PDF
Language(s)
English
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FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Terms, definitions and abbreviated terms
4 Technical requirements
Annex A (informative) - Flowchart of IEC 62668-1 requirements
Annex B (informative) - Example of detailed tests list, linked
with risks levels
Annex C (informative) - iNEMI assessment methodology and
metric development
Annex D (informative) - Summary of SAE AS6171 series
proposed test methods under consideration by
SAE International Techniques for Suspect/Counterfeit
EEE Assembly Detection by Various Test Methods
Bibliography
BS EN 62668-2.
| Committee |
GEL/107
|
| DocumentType |
Draft
|
| Pages |
55
|
| PublisherName |
British Standards Institution
|
| Status |
NA
|
| SAE AS 5553B : 2016 | COUNTERFEIT ELECTRICAL, ELECTRONIC, AND ELECTROMECHANICAL (EEE) PARTS; AVOIDANCE, DETECTION, MITIGATION, AND DISPOSITION |
| ISO 16678:2014 | Guidelines for interoperable object identification and related authentication systems to deter counterfeiting and illicit trade |
| SAE AS 6174 : 2014 | COUNTERFEIT MATERIEL - ASSURING ACQUISITION OF AUTHENTIC AND CONFORMING MATERIEL |
| SAE AS 6171/1 : 2016 | SUSPECT/COUNTERFEIT TEST EVALUATION METHOD |
| SAE AS 6171 : 2016 | TEST METHODS STANDARD; GENERAL REQUIREMENTS, SUSPECT/COUNTERFEIT, ELECTRICAL, ELECTRONIC, AND ELECTROMECHANICAL PARTS |
| MIL-STD-883 Revision K:2016 | TEST METHOD STANDARD - MICROCIRCUITS |
| SAE AS 6171/6 : 2016 | TECHNIQUES FOR SUSPECT/COUNTERFEIT EEE PARTS DETECTION BY ACOUSTIC MICROSCOPY (AM) TEST METHODS |
| MIL-PRF-55681 Revision G:2016 | CAPACITOR, CHIP, MULTIPLE LAYER, FIXED, CERAMIC DIELECTRIC, ESTABLISHED RELIABILITY AND NON-ESTABLISHED RELIABILITY, GENERAL SPECIFICATION FOR |
| SAE AS 6081 : 2012 | FRAUDULENT/COUNTERFEIT ELECTRONIC PARTS: AVOIDANCE, DETECTION, MITIGATION, AND DISPOSITION - DISTRIBUTORS |
| SAE AS 6171/11 : 2016 | TECHNIQUES FOR SUSPECT/COUNTERFEIT EEE PARTS DETECTION BY DESIGN RECOVERY TEST METHODS |
| SAE AS 6171/7 : 2016 | TECHNIQUES FOR SUSPECT/COUNTERFEIT EEE PARTS DETECTION BY ELECTRICAL TEST METHODS |
| MIL-PRF-19500 Revision P:2010 | SEMICONDUCTOR DEVICES, GENERAL SPECIFICATION FOR |
| IEC/ISO 31010:2009 | Risk management - Risk assessment techniques |
| ISO 31000:2009 | Risk management Principles and guidelines |
| IEC TS 62668-1:2016 | Process management for avionics - Counterfeit prevention - Part 1: Avoiding the use of counterfeit, fraudulent and recycled electronic components |
| SEMI T20.2 : 2009(R2016) | GUIDE FOR QUALIFICATIONS OF AUTHENTICATION SERVICE BODIES FOR DETECTING AND PREVENTING COUNTERFEITING OF SEMICONDUCTORS AND RELATED PRODUCTS |
| MIL-STD-750 Revision F:2011 | TEST METHODS FOR SEMICONDUCTOR DEVICES |
| MIL-STD-202-107 Base Document:2015 | Method 107, Thermal Shock |
| MIL-STD-202-106 Base Document:2015 | Method 106, Moisture Resistance |
| MIL-PRF-39014 Revision J:2016 | Capacitor, Fixed, Ceramic Dielectric (General Purpose), Established Reliability and Non-Established Reliability, General Specification for |
| IEC TS 62239-1:2015 | Process management for avionics - Management plan - Part 1: Preparation and maintenance of an electronic components management plan |
| SAE AS 6171/8 : 2016 | TECHNIQUES FOR SUSPECT/COUNTERFEIT EEE PARTS DETECTION BY RAMAN SPECTROSCOPY TEST METHODS |
| SAE AS 6171/3 : 2016 | TECHNIQUES FOR SUSPECT/COUNTERFEIT EEE PARTS DETECTION BY X-RAY FLUORESCENCE TEST METHODS |
| SAE AS 6171/4 : 2016 | TECHNIQUES FOR SUSPECT/COUNTERFEIT EEE PARTS DETECTION BY DELID/DECAPSULATION PHYSICAL ANALYSIS TEST METHODS |
| IEC 62402:2007 | Obsolescence management - Application guide |
| GEIA STD 0016 : 2012 | PREPARING A DMSMS MANAGEMENT PLAN |
| ISO 14001:2015 | Environmental management systems — Requirements with guidance for use |
| IEC TS 62686-1:2015 | Process management for avionics - Electronic components for aerospace, defence and high performance (ADHP) applications - Part 1: General requirements for high reliability integrated circuits and discrete semiconductors |
| SAE ARP 6178 : 2011 | FRAUDULENT/COUNTERFEIT ELECTRONIC PARTS - TOOL FOR RISK ASSESSMENT OF DISTRIBUTORS |
| SAE AS 6171/9 : 2016 | TECHNIQUES FOR SUSPECT/COUNTERFEIT EEE PARTS DETECTION BY FOURIER TRANSFORM INFRARED SPECTROSCOPY (FTIR) TEST METHODS |
| MIL-PRF-39003 Revision N:2016 | Capacitor, Fixed, Electrolytic (Solid Electrolyte), Tantalum, Established Reliability, General Specification for |
| ISO 9001:2015 | Quality management systems — Requirements |
| MIL-STD-202-108 Base Document:2015 | Method 108, Life (at Elevated Ambient Temperature) |
| SAE AS 6171/5 : 2016 | TECHNIQUES FOR SUSPECT/COUNTERFEIT EEE PARTS DETECTION BY RADIOLOGICAL TEST METHODS |
| MIL-STD-1580 Revision B:2003 | DESTRUCTIVE PHYSICAL ANALYSIS FOR ELECTRONIC, ELECTROMAGNETIC, AND ELECTROMECHANICAL PARTS |
| ISO 28000:2007 | Specification for security management systems for the supply chain |
| IEC 60068-2-1:2007 | Environmental testing - Part 2-1: Tests - Test A: Cold |
| IEC 60115-8:2009 | Fixed resistors for use in electronic equipment - Part 8: Sectional specification - Fixed surface mount resistors |
| SEMI T20 : 2010(R2016) | SPECIFICATION FOR AUTHENTICATION OF SEMICONDUCTORS AND RELATED PRODUCTS |
| ISO Guide 73:2009 | Risk management — Vocabulary |
| IEC 60068-2-30:2005 | Environmental testing - Part 2-30: Tests - Test Db: Damp heat, cyclic (12 h + 12 h cycle) |
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