MIL D 83532 : A (3) SUPP 1
Superseded
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
DELAY LINES, ACTIVE
Superseded date
12-30-1991
Published date
01-12-2013
Publisher
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Covers requirements for fixed (tapped and untapped) pulse delay lines.
| Committee |
FSC 5999
|
| DocumentType |
Standard
|
| PublisherName |
US Military Specs/Standards/Handbooks
|
| Status |
Superseded
|
| MIL-STD-1837 Revision B:1991 | MISCELLANEOUS ELECTRICAL AND ELECTRONIC COMPONENTS, SELECTION AND USE OF |
| MIL D 83532/4 : A | DELAY LINES, 14 PIN DIP COMPATIBLE, 3 DELAY CIRCUITS PER PACKAGE |
| MIL D 83532/5 : (1) | DELAY LINES, ACTIVE, 16-PIN DIP COMPATIBLE, PROGRAMMABLE 3-BIT, TTL COMPATIBLE |
| MIL D 83532/1 : A | DELAY LINES, 14 PIN DIP COMPATIBLE, 5 TAP |
| MIL D 83532/3 : A | DELAY LINES, 14 PIN DIP COMPATIBLE, 10 TAP |
| MIL D 83532/2 : B | DELAY LINES, 14 PIN DIP COMPATIBLE, 5 TAP |
| MIL-M-55565 Revision C:1988 | MICROCIRCUITS, PACKAGING OF |
| MIL D 83532/6 : (1) | DELAY LINES, ACTIVE, 16-PIN DIP COMPATIBLE, PROGRAMMABLE 3-BIT, EMITTER-COUPLED LOGIC |
| MIL-STD-1772 Revision B:1990 | CERTIFICATION REQUIREMENTS FOR HYBRID MICROCIRCUITS FACILITIES AND LINES |
| MIL-M-55565 Revision C:1988 | MICROCIRCUITS, PACKAGING OF |
| MIL-STD-883 Revision K:2016 | TEST METHOD STANDARD - MICROCIRCUITS |
| MIL-STD-810 Revision G:2008 | ENVIRONMENTAL ENGINEERING CONSIDERATIONS AND LABORATORY TESTS |
| MIL-STD-1276 Revision H:2013 | Leads for Electronic Component Parts |
| DOD STD 100 : C NOTICE 6 | ENGINEERING DRAWING PRACTICES |
| MIL-STD-1686 Revision C:1995 | ELECTROSTATIC DISCHARGE CONTROL PROGRAM FOR PROTECTION OF ELECTRICAL AND ELECTRONIC PARTS, ASSEMBLIES AND EQUIPMENT (EXCLUDING ELECTRICALLY INITIATED EXPLOSIVE DEVICES) |
| MIL-STD-45662 Revision A:1988 | CALIBRATION SYSTEMS REQUIREMENTS |
| MIL-M-38510 Revision J:1991 | MICROCIRCUITS, SPECIFICATION FOR |
| J-W-1177 Revision B:1988 | WIRE, MAGNET, ELECTRICAL, GENERAL SPECIFICATION |
| MIL-STD-790 Revision G:2011 | ESTABLISHED RELIABILITY AND HIGH RELIABILITY QUALIFIED PRODUCTS LIST (QPL) SYSTEMS FOR ELECTRICAL, ELECTRONIC, AND FIBER OPTIC PARTS SPECIFICATIONS |
| QQ-S-571 Revision F:1994 | SOLDER, ELECTRONIC (96 TO 485 DEGREES C) |
| MIL S 19500 : J | SEMICONDUCTOR DEVICES, GENERAL SPECIFICATION FOR |
| MIL C 123 : B | CAPACITORS, FIXED, CERAMIC DIELECTRIC, (TEMPERATURE STABLE AND GENERAL PURPOSE), HIGH RELIABILITY, GENERAL SPECIFICATION FOR |
| MIL H 38534 : B (1) | HYBRID MICROCIRCUITS, GENERAL SPECIFICATION FOR |
| MIL C 55681 : D SUPP 1 | CAPACITOR, CHIP, MULTIPLE LAYER, FIXED UNENCAPSULATED, CERAMIC DIELECTRIC, ESTABLISHED RELIABILITY, GENERAL SPECIFICATION FOR |
| MIL-F-14256 Revision F:1993 | FLUX, SOLDERING, LIQUID (ROSIN BASE) |
| MIL R 55342 : C | RESISTORS, FIXED, FILM, CHIP, ESTABLISHED RELIABILITY, GENERAL SPECIFICATION FOR |
| MIL-STD-202 Revision H:2015 | ELECTRONIC AND ELECTRICAL COMPONENT PARTS |
| MIL-STD-1285 Revision D:2004 | MARKING OF ELECTRICAL AND ELECTRONIC PARTS |
| MIL-STD-105 Revision E:1989 | SAMPLING PROCEDURES AND TABLES FOR INSPECTION BY ATTRIBUTES |
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