IEC 60747-4-2:2000
Withdrawn
A Withdrawn Standard is one, which is removed from sale, and its unique number can no longer be used. The Standard can be withdrawn and not replaced, or it can be withdrawn and replaced by a Standard with a different number.
Semiconductor devices - Discrete devices - Part 4-2: Microwave diodes and transistors - Integrated-circuit microwave amplifiers - Blank detail specification
Hardcopy , PDF , PDF 3 Users , PDF 5 Users , PDF 9 Users
12-31-2021
English
04-07-2000
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FOREWORD
INTRODUCTION
1 Marking and ordering information
1.1 Marking
1.2 Ordering information
2 Application-related description
3 Specification of the function
4 Limiting values (absolute maximum rating system)
5 Operating conditions (within the specified operating
ambient or case temperature range)
5.1 Power supply voltage
5.2 Power supply current
5.3 Input power (where appropriate)
5.4 Voltage and/or current at another or other
terminal(s) (where appropriate)
5.5 External element(s) (where appropriate)
5.6 Operating frequency range
5.7 Operating temperature range
6 Electrical characteristics
6.1 Static characteristics
6.2 AC characteristics
7 Programming
8 Mechanical and environmental ratings, characteristics
and data
9 Additional information
9.1 Block diagram
9.2 Recommendation for any associated device(s)
9.3 Effects of temperature
9.4 Handling precautions, or electrostatic-sensitive
device(s)
9.5 Internal protection
9.6 Application data
10 Screening
11 Quality assessment procedures
11.1 Qualification approval procedure
11.2 Capability approval procedure
12 Structural similarity procedures
13 Test conditions and inspection requirements
13.1 General
13.2 Sampling requirements and formation of inspection
lots
13.3 Inspection tables
13.4 Delayed delivery
14 Additional measurement method
Aims to define quality assessment procedures in such a manner that electronic components released by one participating country as conforming to the requirements of an applicable specification are equally acceptable in all other participating countries without the need for further testing.
| DocumentType |
Standard
|
| Pages |
17
|
| PublisherName |
International Electrotechnical Committee
|
| Status |
Withdrawn
|
| Standards | Relationship |
| BS IEC 60747-4.2 : 2000 | Identical |
| NEN IEC 60747-4-2 : 2000 | Identical |
| BS QC750116(2000) : 2000 | Identical |
| BS IEC 60747-4-2:2000 | Identical |
| IEC 60747-4:2007+AMD1:2017 CSV | Semiconductor devices - Discrete devices - Part 4: Microwave diodes and transistors |
| IEC 60747-10:1991 | Semiconductor devices - Part 10: Generic specification for discrete devices and integrated circuits |
| IEC 60748-11:1990 | Semiconductor devices - Integrated circuits - Part 11: Sectional specification for semiconductor integrated circuits excluding hybrid circuits |
| IEC 60068-2-17:1994 | Basic environmental testing procedures - Part 2-17: Tests - Test Q: Sealing |
| IEC 60747-1:2006+AMD1:2010 CSV | Semiconductor devices - Part 1: General |
| IEC 60749:1996+AMD1:2000+AMD2:2001 CSV | Semiconductor devices - Mechanical and climatic test methods |
| IEC 60748-2-10:1994 | Semiconductor devices - Integrated circuits - Part 2: Digital integrated circuits - Section 10: Blank detail specification for integrated circuit dynamic read/write memories |
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