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BS EN 60603-2:1998

Current

Current

The latest, up-to-date edition.

Connectors for frequencies below 3 MHz for use with printed boards Detail specification for two-part connectors with assessed quality, for printed boards, for basic grid of 2,54 mm (0,1 in) with common mounting features

Available format(s)

Hardcopy , PDF

Language(s)

English

Published date

06-30-2006

US$364.65
Excluding Tax where applicable

Foreword
1 Scope
2 Normative references
3 IEC type designation
4 Common features
   4.1 Mounting dimensions
   4.2 Mating information
   4.3 Survey of styles
5 Dimensions
   5.1 General
   5.2 Fixed board connectors
   5.3 Free board connectors
   5.4 Mating information
   5.5 Accessories
   5.6 Mounting information for fixed board connectors
   5.7 Mounting information for free board connectors
6 Gauges
   6.1 Sizing gauges and retention force gauges
   6.2 Test panel (for voltage proof test)
7 Characteristics
   7.1 Climatic category
   7.2 Electrical
   7.3 Mechanical
8 Test schedule
   8.1 General
9 Quality assessment procedures
   9.1 Qualification approval testing
   9.2 Quality conformance inspection
   9.3 Delayed delivery, re-inspection
10 Ordering information
Annex A (normative) Test phase BP 3.2: Corrosion industrial
        atmosphere
Annex B (informative) Special contacts for connectors Style M
Annex C (normative) Inductance test method
Annex ZA (normative) Normative references to international
         publications with their corresponding European
         publications

Applicable to groups of related connectors to be used with printed boards. Include connectors with high contact density for low-voltage applications and range to connectors for heavy currents and high voltages with fewer contacts.

Committee
EPL/48
DevelopmentNote
Also numbered as IEC 60603-2 & QC 010000XX0002. (11/2005)
DocumentType
Standard
Pages
86
PublisherName
British Standards Institution
Status
Current

This part of IEC 61300, when required by the relevant specification, evaluates the ability of the materials used for passive fibre optic devices to withstand the action of fungi and bacteria and soil microorganisms likely to be encountered during usage. The type and extent of material deterioration may be determined by visual examination and/or changes in mass or any other physical property. Since mould growth conditions include high relative humidity, the test is applicable to passive optic devices under humid operating conditions according to IEC 61753-1, in storage and/or transport.

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