NASA GSFC-STD-6001:2021
Current
The latest, up-to-date edition.
Area Array Package Assembly and Manufacturing Practices for Flight Hardware
Hardcopy , PDF
English
30-07-2021
Important note : All end users must be registered with an Account prior to user licenses being assigned.The purpose of this standard is to provide requirements and recommendations intended to facilitate production of defect-free area array solder joint interconnects to printed circuit boards intended for use in Flight, Flight Spare and Custom Mission Critical Support Hardware applications.
| DocumentType |
Standard
|
| Pages |
17
|
| ProductNote |
THIS STANDARD IS ALSO REFER TO IPC-6012S,IPC J-STD-001S,GSFC-STD-7000,GPR 8705.4
|
| PublisherName |
National Aeronautics and Space Administration
|
| Status |
Current
|
| Supersedes |
Access your standards online with a subscription
Features
-
Simple online access to standards, technical information and regulations.
-
Critical updates of standards and customisable alerts and notifications.
-
Multi-user online standards collection: secure, flexible and cost effective.