
MIL-PRF-31032-2 Revision C:2017
Current
The latest, up-to-date edition.

Printed Wiring Board, Rigid, Single and Double Layer, Thermosetting Resin Base Material, with or Without Plated-Through Holes, for Soldered Part Mounting
English
02-06-2017
1. SCOPE
2. APPLICABLE DOCUMENTS
3. REQUIREMENTS
4. VERIFICATION
5. PACKAGING
6. NOTES
Describes the generic performance requirements for rigid, single and double sided (1 or 2 conductor layers) printed wiring boards (hereafter designated printed board) with or without plated holes that will use soldering for component/part mounting.
DocumentType |
Standard
|
Pages |
26
|
PublisherName |
US Military Specs/Standards/Handbooks
|
Status |
Current
|
This specification covers the generic performance requirements for rigid, single and double sided (1 or 2 conductor layers) printed wiring boards (hereafter designated printed board) with or without plated holes that will use soldering for component/part mounting (see 6.1.1).
MIL-PRF-55110 Revision H:2014 | Printed Wiring Board, Rigid, General Specification for |
IPC A 600 : H | ACCEPTABILITY OF PRINTED BOARDS |
IPC 9252 : A | REQUIREMENTS FOR ELECTRICAL TESTING OF UNPOPULATED PRINTED BOARDS |
IPC TM 650 : 0 | TEST METHODS MANUAL |
MIL-PRF-31032 Revision C:2016 | Printed Circuit Board/Printed Wiring Board, General Specification for |
ASTM B 567 : 1998 | Standard Test Method for Measurement of Coating Thickness by the Beta Backscatter Method |
IPC 2221B:2012 | GENERIC STANDARD ON PRINTED BOARD DESIGN |
IPC 2222 : A | SECTIONAL DESIGN STANDARD FOR RIGID ORGANIC PRINTED BOARDS |
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