IEC 61188-7:2017
Current
The latest, up-to-date edition.
Printed boards and printed board assemblies - Design and use - Part 7: Electronic component zero orientation for CAD library construction
Hardcopy , PDF 1 User , PDF 3 Users , PDF 5 Users , PDF 9 Users
English - French, English
10-04-2017
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FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Terms and definitions
4 Basic rules
5 Origin point of land pattern
6 Land pattern to footprint comparison
7 Components with one terminal
IEC 61188-7:2017 establishes a consistent technique for the description of electronic component orientation, and their land pattern geometries. This facilitates and encourages a common data capture and transfer methodology amongst and between global trading partners.
This edition includes the following significant technical changes with respect to the previous edition:
a) Figure 1 has been corrected;
b) the term “rectangle” has generally been replaced by “polygon”;
c) level B has been indicated as preferred level for new libraries.
| Committee |
TC 91
|
| DevelopmentNote |
Stability Date: 2024. (04/2017)
|
| DocumentType |
Standard
|
| ISBN |
978-2-8322-7388-3
|
| Pages |
40
|
| PublisherName |
International Electrotechnical Committee
|
| Status |
Current
|
| Supersedes |
| Standards | Relationship |
| DIN EN 61188-7:2016-05 (Draft) | Identical |
| EN 61188-7:2017 | Identical |
| PN EN 61188-7 : 2017 | Identical |
| CEI EN 61188-7 : 2010 | Identical |
| NEN EN IEC 61188-7 : 2017 | Identical |
| UNE-EN 61188-7:2017 | Identical |
| JIS C 61188-7:2020 | Identical |
| NF EN 61188-7 : 2015 | Identical |
| PNE-prEN 61188-7:2016 | Identical |
| BS EN 61188-7:2017 | Identical |
| I.S. EN 61191-2:2017 | PRINTED BOARD ASSEMBLIES - PART 2: SECTIONAL SPECIFICATION - REQUIREMENTS FOR SURFACE MOUNT SOLDERED ASSEMBLIES |
| BS EN 61191-3:2017 | Printed board assemblies Sectional specification. Requirements for through-hole mount soldered assemblies |
| IEC 61191-4:2017 | Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies |
| BS EN 61191-1:2013 | Printed board assemblies Generic specification. Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies |
| I.S. EN 61191-1:2013 | PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES (IEC 61191-1:2013 (EQV)) |
| EN 61191-3:2017 | Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies |
| IEC 61191-2:2017 | Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies |
| I.S. EN 61191-4:2017 | PRINTED BOARD ASSEMBLIES - PART 4: SECTIONAL SPECIFICATION - REQUIREMENTS FOR TERMINAL SOLDERED ASSEMBLIES |
| I.S. EN 61191-3:2017 | PRINTED BOARD ASSEMBLIES - PART 3: SECTIONAL SPECIFICATION - REQUIREMENTS FOR THROUGH-HOLE MOUNT SOLDERED ASSEMBLIES |
| BS EN 61191-4:2017 | Printed board assemblies Sectional specification. Requirements for terminal soldered assemblies |
| IEC 61191-1:2013 | Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies |
| 15/30327712 DC : 0 | BS EN 61191-1 - PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES |
| 11/30255124 DC : 0 | BS EN 61191-1 - PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES |
| IEC 61191-3:2017 | Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies |
| EN 61191-2:2017 | Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies |
| EN 61191-1:2013 | PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES (IEC 61191-1:2013) |
| EN 61191-4:2017 | Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies |
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