BS EN 61192-1:2003

Introduction
1 Scope and object
2 Normative references
3 Terms and definitions
4 General requirements
    4.1 Order of precedence
    4.2 Process control
    4.3 Facilities
    4.4 Process identification
5 Pre-process activities
    5.1 Design checks
    5.2 Specification and procurement of components
    5.3 Specification and procurement of printed boards
    5.4 Specification and procurement of process materials
    5.5 Inspection plan, inspection facilities and handling
    5.6 Storage and kitting of components, boards and materials
    5.7 Handling during assembly, packaging and shipping
    5.8 Electrical testing
6 Component preparation
    6.1 Lead and termination solderability
    6.2 Lead forming
    6.3 Lead flattering
    6.4 Lead cropping
    6.5 Lead coplanarity
    6.6 Thermal shock during re-tinning
    6.7 Moisture and gas traps
7 Mounting structure and printed board preparation
    7.1 Surface preparation
    7.2 Temporary masking requirements
    7.3 Gold on printed surface-mount lands
    7.4 Printed board condition
8 Surface-mount solder paste deposition
    8.1 Description of process
    8.2 Storage and handling of solder paste
    8.3 Screen (off-contact) printing
    8.4 Stencil (in-contact) printing
    8.5 Syringe dispensing
    8.6 Transfer deposition of solder performs
9 Non-conductive adhesive deposition and curing
    9.1 Stencil printing
    9.2 Syringe dispensing
    9.3 Pin transfer printing
    9.4 Adhesive curing
10 Surface-mounted component placement
    10.1 Leadless discrete components with metallized
          terminations
    10.2 Leadless circular cylinder components, for example,
          metal electrode leadless faces (MELFs)
    10.3 Leaded discrete small component packages
    10.4 Leaded integrated circuit packages
    10.5 Leaded 'fine-pitch' integrated circuit packages
    10.6 Modified leaded through-hole packages
    10.7 Leadless chip carrier packages
    10.8 Placement equipment
11 Through-hole component insertion
    11.1 General
    11.2 Axial lead components (two-leads)
    11.3 Radial lead components (two-leads)
    11.4 Radial lead components (three or more leads)
    11.5 Multilead integrated circuit packages
    11.6 Pin grid array (PGA) components
    11.7 Surface mount packages modified for insertion
    11.8 Large components
    11.9 Insertion methods and equipment
    11.10 Cutting and clinching leads
12 Placement of terminals and press-fit pins
    12.1 Attachment of terminals to printed boards
    12.2 Solderability wires and component leads to terminals
13 Reflow soldering
    13.1 Infrared reflow soldering in pass-through equipment
    13.2 Convection reflow solderability in pass-through equipment
    13.3 Mixed infrared and convection reflow soldering in
          pass-through equipment
    13.4 Vapour phase reflow soldering
    13.5 Laser scan reflow soldering
    13.6 Thermode (hot bar) reflow soldering
    13.7 Hot gas multijet reflow soldering
    13.8 Focused infrared multi-point reflow soldering
14 Immersion soldering
    14.1 General requirements
    14.2 Wave soldering
    14.3 Drag soldering
    14.4 Hot dip soldering
15 Individual point soldering
    15.1 Manual soldering with an iron
    15.2 Hot gas pencil reflow soldering
16 Cleanliness/cleaning
    16.1 Use of 'no clean' fluxes
    16.2 Cleaning materials
    16.3 Cleaning processes
    16.4 Cleanliness assessment
17 Electrical test
    17.1 In-circuit test
    17.2 Functional test
    17.3 Test probes and probe lands
18 Rework and repair
    18.1 General
    18.2 Unmarked components
    18.3 Pre-heating printed boards and sensitive components
    18.4 Re-use of removed components
    18.5 Selection of rework tools and equipment
    18.6 Surface-mounted component realignment
    18.7 Adding solder to existing joints
    18.8 Removing excess solder
    18.9 Component removal
    18.10 Component replacement
    18.11 Repair of assemblies returned from the field
19 Conformal coatings, including solder resist
    19.1 General
    19.2 Conformal protective coating
    19.3 Solder mask coating
20 Packaging and shipping
    20.1 Materials
    20.2 Mechanical protection
    20.3 Marking/labelling
    20.4 Handling
21 Training
    21.1 Training of designers, engineers and senior line
          management
    21.2 Training production line personnel
Figures
Tables

Describes requirements and guidelines for good workmanship and practice in the preparation, soldering, inspection and testing of electronic and electrical assemblies.

Specifies general requirements for workmanship in soldered electronic assemblies on printed boards and on similar laminates attached to the surface(s) of organic substrates. Defines requirements and guidelines for good workmanship and practice in the preparation, soldering, inspection and testing of electronic and electrical assemblies. Enables achievement of high yields and high product quality through process control in production.